Probe Type | Vertical |
Probe Material | Film bump type / Ni Alloy |
Min. Pad Pitch | 60μm |
Recommended O/D | 2mil (Max.3mil) |
Planarity | <5μm |
Alignment | ±3μm |
Contact Force(gf/mil) | 1.5g/mil (Standard) |
Max Current | 800mA |
Frequency | > 3GHz |
Contact Resistance | <3Ω |
Array | Available Multi para |